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TASK + 3I170DW

Productfeatures LEXCOM TASK + 3I170DW

  • 6th / 7th Gen Intel® Skylake-S / Kaby Lake-S i7 / i5 / i3 CPU Intel® Q170 Chipset
  • 1 x DDR4 SODIMM socket, Max. 16GB
  • Multiple Independent display: VGA & HDMI
  • 5 x Intel GbE LAN, 2 x USB 3.0, 2 x USB 2.0, 2 x COM 2 x Mini PCIe, 1 x SIM, Audio
Sale to corporate customers
Get individual price by e-mail
  • TASK3I170DW
  • Lexsystem
Product information "TASK + 3I170DW"
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MODEL TASK + 3I170DW System Dimension(WxDxH) 210W x 125D x 77H mm... more
MODEL TASK + 3I170DW
System Dimension(WxDxH) 210W x 125D x 77H mm
Weight(Incl.M/B) 1.9 kg
CPU 6th / 7th Gen Intel® Skylake-S / Kaby Lake-S i7 / i5 / i3 CPU
Chipset Intel ® Q170
Memory 1 x DDR4 SODIMM socket, Max. 16GB
Storage mSATA, HDD / SSD*
Expansion slots 1 x Full-size Mini PCIe (PCIe / mSATA / USB)
1 x Half-size Mini PCIe (PCIe / mSATA / USB)
1 x SIM
I/O ports Network 5 x Intel GbE
USB 2 x USB 3.0, 2 x USB 2.0
Serial ports 2 x RS232 / 422 / 485
Display 1 x VGA, 1 x HDMI
Audio Line-out / Mic-in
GPIO DI / DO (Option)
Optional Modules
& Accessory
GPS, Bluetooth, PoE, WiFi, 4G LTE, Isolated COM,
battery UPS, DI/DO, Video Input
*SATA Kit, VESA Mounting Kit
Power DC input : +9~36V
AC input : External adapter 100 / 240V ; AC-DC 84W
Operating Temp.
(100 % CPU usage)
-20°C to +60°C with mSATA / SSD
Storage Temp. -20°C to +70°C
Relative Humidity 95% @ 40°C, non-condensing
  • Download PDF Datasheet LEXCOM TASK + 3I170DW


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