IPC-Manufacturer

Productfeatures Neousys Nuvis-7306RT

•     Intel® 9th/ 8th-Gen Core™ i7/i5 LGA1151 socket-type CPU
•     Integrated vision-specific I/O:
•     4-CH CC/CV lighting controller
•     4-CH camera trigger outputs
•     1-CH quadrature encoder input
•     8-CH isolated DI and 8-CH isolated DO
•     MCU-based, real-time I/O control by DTIO V2 and NuMCU
•     Built-in camera interfaces:
•     4-CH IEEE 802.3at Gigabit PoE+ ports with screw-lockk
•     8-CH USB 3.1 ports with screw-lock
•     Two x16 PCIe slots for NVIDIA 120W GPU and/or capture card

Productfeatures Arestech MERA-3100

•     9th / 8th Gen Intel® CFL-R/S LGA 1151 Processors
•     Triple Display Supported by VGA, DVI and Display Port
•     2 x DDR4 2400/ 2666MHz SO-DIMM, Max up to 64GB
•     3 x Intel GbE Ports, Support Wake-on-LAN and PXE
•     2 x CFast/ mSATA Connector
•     4 x Full-size Mini-PCIe and 4 x SIM Sockets
•     9~48V DC Input with Built-in Ignition Power Control
•     -40°C ~ 70°C Wide Temperature Operation

Productfeatures Arestech MEGA-3110

•     Supports 8th / 9th Intel® Core™-i LGA 1151 Processors
•     Triple Display Supported by VGA, DVI and Display Port
•     Dual DDR4 2400 MHz SO-DIMM up to 32 GB
•     3 x Intel GbE Ports, Support Wake-on-LAN and PXE
•     2 x Removable 2.5“ SATA HDD Bays
•     2 x Internal 2.5” SATA HDD Bays
•     Supporting RAID 0, 1, 5, 10
•     -40 ~ 70°C Operating Temperature
•     2 x CFast / mSATA Sockets

Productfeatures Arestech MEVA-2010

•     Intel® Celeron® Processor J1900, up to 2.42GHz
•     Dual Display Supported by DVI-I and DisplayPort
•     1 x DDR3L 1066/ 1333MHz SO-DIMM. Max up to 8GB
•     2 x Intel i210-AT GbE Ports
•     Supporting Wake-on-LAN and PXE
•     2 x Full-Size Mini-PCIe, 2x SIM Socket
•     9~48V DC Input with Built-in Ignition Power Control
•     -40°C ~ 70°C Wide Temperature Operation

Productfeatures Arestech MEVA-3110

•     Supports 8th/9th Gen Intel® CFL-R/S LGA 1151 Processors
•     Triple Display Supported by VGA, DVI and Display Port
•     2 x DDR4 2400 / 2666MHz SO-DIMM, Max up to 64GB
•     3 x Intel GbE Ports, Supporting Wake-on-LAN and PXE
•     4 x Removable 2.5“ SATA HDD bay
•     2 x CFast / mSATA, Supporting RAID 0, 1, 5, 10
•     4 x Full-Size Mini-PCIe and 4 x SIM Sockets
•     9~48V DC Input with Built-in Ignition Power Control
•     -40°C ~ 70°C Wide Temperature Operation

Productfeatures Arestech MERA-2000

•     Intel® Celeron® Processor J1900, up to 2.42GHz
•     Dual Displays Supported by DVI-I and DisplayPort
•     1 x DDR3L 1066/ 1333MHz SO-DIMM. Max up to 8GB
•     2 x Intel i210-AT GbE Ports
•     Supporting Wake-on-LAN and PXE
•     2 x Full-size Mini-PCIe, 2x SIM Socket
•     9~48V DC Input with Built-in Ignition Power Control
•     -40°C ~ 70°C Wide Temperature Operation

Productfeatures Lexsystem 1U-3I612DW

•     6th / 7th Gen Intel® Skylake-U / Kaby Lake-U i7 / i5 / i3 CPU
•     2 x DDR4 SODIMM socket, Max. 32GB
•     Multiple Independent display: DP, HDMI & eDP
•     5 x Intel GbE LAN, 2 x SFP Fiber, 4 x USB 3.0, 2 x COM
•     2 x Mini PCIe, 4DI / 4DO, 1 x Nano SIM

Productfeatures Lexsystem 1U-CI170A

•     6th / 7th Gen Intel® Skylake-S / Kaby Lake-S i7 / i5 / i3 CPU
•     Q170 Chipset
•     2 x DDR4 SODIMM socket, Max. 32GB
•     Multiple Independent display: DP, HDMI & DVI
•     2 x Intel GbE LAN, 4 x USB 3.0, 4 x COM
•     2 x PCIe x 8, 2 x Mini PCIe, 1 x M.2, 2 x SIM

Productfeatures Lexsystem Half 1U 3I380D

•     Intel® Bay Trail CPU: Atom™ E3815, Celeron® J1900
•     On Board DDR3L 2GB (3I380D-I12)
•     1 x SODIMM, Max. 8GB (3I380D-D90)
•     Independent display: VGA, HDMI
•     4 x GbE, 1 x COM, 3 x USB
•     2 x Mini PCIe, 1 x SIM

Productfeatures Lexsystem 1U-CI170C

•     6th / 7th Gen Intel® Skylake-S / Kaby Lake-S i7 / i5 / i3 CPU
•     2 x DDR4 SODIMM socket, Max. 32GB
•     Multiple Independent display: DP, HDMI & DVI
•     5 x Intel GbE LAN, 4 x USB 3.0, 4 x COM
•     2 x PCIe x 8, 2 x Mini PCIe, 1 x M.2, 2 x SIM

Productfeatures Nexcom aROK-8110

•     Rolling stock AI recognition and machine vision applications
•     Intel® 8th/9th Gen Core™/Xeon® CPU processing power
•     4 x PCIe 3.0 slots for graphics/inference/frame grabber cards
•     Ultra-fast NVMe M.2/U.2 media
•     High-speed multi-cameras image capture
•     RAID 0/1/5/10 configurable for data secure and integrity
•     24/36 VDC input with ignition management
•     Special fixture design avoids vibration issues
•     WWAN/5G NR, WLAN and GNSS with up to 4 SIM slots
•     EN 50155 OT4 and MIL-STD-810G for anti-vibration/shock
•     Smart fan design with temperature-based RPMs

Productfeatures Nexcom aROK-5510

•     Intel® 8th/9th-Gen Core™/Xeon® LGA1151 socket-type CPU
•     100W power consumption graphics card support
•     Eight SIM cards + four WWAN modules support
•     LTE/5G WWAN module support
•     6 x External SSD for RAID 0, 1, 5, 10
•     PCle 3.0 x4 NVMe 1.3 high performance SSD support
•     EN 50155, class OT4 conformity
•     3 x mini-PCIe + 3 x M.2 socket expansion
•     Smart fan design with temperature-based RPMs
•     Optional expansion module for 4 x PoE M12 or 2 x 10GbE SFP+
•     Rackmount platform