Productfeatures Lexsystem 1U-3I612DW

•     6th / 7th Gen Intel® Skylake-U / Kaby Lake-U i7 / i5 / i3 CPU
•     2 x DDR4 SODIMM socket, Max. 32GB
•     Multiple Independent display: DP, HDMI & eDP
•     5 x Intel GbE LAN, 2 x SFP Fiber, 4 x USB 3.0, 2 x COM
•     2 x Mini PCIe, 4DI / 4DO, 1 x Nano SIM

Productfeatures Lexsystem 1U-CI170A

•     6th / 7th Gen Intel® Skylake-S / Kaby Lake-S i7 / i5 / i3 CPU
•     Q170 Chipset
•     2 x DDR4 SODIMM socket, Max. 32GB
•     Multiple Independent display: DP, HDMI & DVI
•     2 x Intel GbE LAN, 4 x USB 3.0, 4 x COM
•     2 x PCIe x 8, 2 x Mini PCIe, 1 x M.2, 2 x SIM

Productfeatures Lexsystem Half 1U 3I380D

•     Intel® Bay Trail CPU: Atom™ E3815, Celeron® J1900
•     On Board DDR3L 2GB (3I380D-I12)
•     1 x SODIMM, Max. 8GB (3I380D-D90)
•     Independent display: VGA, HDMI
•     4 x GbE, 1 x COM, 3 x USB
•     2 x Mini PCIe, 1 x SIM

Productfeatures Lexsystem 1U-CI170C

•     6th / 7th Gen Intel® Skylake-S / Kaby Lake-S i7 / i5 / i3 CPU
•     2 x DDR4 SODIMM socket, Max. 32GB
•     Multiple Independent display: DP, HDMI & DVI
•     5 x Intel GbE LAN, 4 x USB 3.0, 4 x COM
•     2 x PCIe x 8, 2 x Mini PCIe, 1 x M.2, 2 x SIM

Productfeatures Nexcom aROK-8110

•     Rolling stock AI recognition and machine vision applications
•     Intel® 8th/9th Gen Core™/Xeon® CPU processing power
•     4 x PCIe 3.0 slots for graphics/inference/frame grabber cards
•     Ultra-fast NVMe M.2/U.2 media
•     High-speed multi-cameras image capture
•     RAID 0/1/5/10 configurable for data secure and integrity
•     24/36 VDC input with ignition management
•     Special fixture design avoids vibration issues
•     WWAN/5G NR, WLAN and GNSS with up to 4 SIM slots
•     EN 50155 OT4 and MIL-STD-810G for anti-vibration/shock
•     Smart fan design with temperature-based RPMs

Productfeatures Nexcom aROK-5510

•     Intel® 8th/9th-Gen Core™/Xeon® LGA1151 socket-type CPU
•     100W power consumption graphics card support
•     Eight SIM cards + four WWAN modules support
•     LTE/5G WWAN module support
•     6 x External SSD for RAID 0, 1, 5, 10
•     PCle 3.0 x4 NVMe 1.3 high performance SSD support
•     EN 50155, class OT4 conformity
•     3 x mini-PCIe + 3 x M.2 socket expansion
•     Smart fan design with temperature-based RPMs
•     Optional expansion module for 4 x PoE M12 or 2 x 10GbE SFP+
•     Rackmount platform

Productfeatures Nexcom VTC-7251-GCIoT

•     AI mobile vehicle surveillance computer
•     Built-in Google Edge TPU ML mini-PICe accelerator coprocessor
•     Intel® Core™ 8th Gen. desktop, i7-8700T, up to 4 GHz, 6 Core
•     4 x Independent 10/100/1000 Mbps PoE 802.3af/at, total 60W
•     1 x VGA and 1 x HDMI video output
•     2 x External SSD and 2 x mSATA (BIOS selection) for RAID 0, 1
•     3 x WWAN module slot, each for 2 x external SIM socket
•     4 x mini-PCIe slot and 1 x M.2 B key slot
•     CE/FCC/E mark

Productfeatures Nexcom VTC-6222-GCIoT

•     Fanless AI Vehicle Computer
•     Built-in Google Edge TPU ML accelerator coprocessor
•     Intel Atom® processor quad core E3950, up to 2.0GHz
•     4 x PoE (802.3af/at, max. 60W)
•     Built-in u-blox-M8N GPS
•     Built-in CAN Bus 2.0B
•     Three video outputs, one VGA and two HDMI
•     E Mark conformity
•     3 x mini-PCIe socket expansion
•     Dual external storage (compatible with 15mm disk)
•     1 x USB DOM to run OS
•     1 x SD card for exporting and backing up data

Productfeatures Nexcom nROK-6222-GCIoT

•     Fanless Vehicle Computer
•     Built-in Google Edge TPU ML accelerator coprocessor
•     Intel Atom® processor quad core E3950, up to 2.0GHz
•     4 x PoE (802.3af/at, max. 60W)
•     Built-in u-blox-M8N GPS
•     Three video outputs, one VGA and two HDMI
•     EN50155 conformity
•     3 x mini-PCIe socket expansion
•     Dual external storage (compatible with 15mm disk)
•     1 x USB DOM to run OS
•     1 x SD card for exporting and backing up data
•     Optional power isolation kit support

Productfeatures Nexcom MVS-2623-GCIoT

•     Built-in Google Edge TPU ML accelerator coprocessor
•     Modular design for flexible I/O expansion
•     Three SIM cards + dual WWAN modules support
•     8 x 10/100/1000 Mbps 802.3af PoE ports
•     U-blox NEO-M8N module, optional dead reckoning support
•     Intel Atom® x7, 4c, 2.0GHz E3950
•     Dual removable SATA 3.0 2.5” SSD/HDD
•     iButton for driver ID identification
•     Built-in CAN 2.0B optional OBDII function (SAE J1939/J1708)
•     Pattern number M531607 registered
•     Easy way to expand diverse I/O cards

Productfeatures Nexcom VTC-7251-IMIoT

•     Edge AI Vehicle Computer
•     Intel® Movidius™ Myriad-X deep learning accelerator module
•     Intel® Core™ 8th Gen. desktop, i7-8700T, up to 4 GHz, 6 Core
•     4 x Independent 10/100/1000 Mbps PoE 802.3af/at, total 60W
•     1 x VGA and 1 x HDMI video output
•     2 x External SSD and 2 x mSATA (BIOS selection) for RAID 0, 1
•     3 x WWAN module slot, each for 2 x external SIM socket
•     4 x mini-PCIe slot and 1 x M.2 B key slot
•     CE/FCC/E mark

Productfeatures Nexcom VTC-6222-IMIoT

•     Edge AI Vehicle Computer
•     Intel® Movidius™ Myriad™-X deep learning accelerator module
•     Intel Atom® processor quad core E3950, up to 2.0GHz
•     4 x PoE (802.3af/at, max. 60W)
•     Built-in u-blox-M8N GPS
•     Built-in CAN Bus 2.0B
•     Three video outputs, one VGA and two HDMI
•     E Mark conformity
•     3 x mini-PCIe socket expansion
•     Dual external storage (compatible with 15mm disk)
•     1 x USB DOM to run OS
•     1x SD card for exporting and backing up data