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TINO - CI770A

Productfeatures LEXCOM TINO - CI770A

  • Intel® Gen 3rd Celeron®, i3,i5 i7 with QM77 Chipset
  • Fanless design -20°C to +60° (100% CPU usage)
  • mSATA/SATA
  • 12V DC input
  • Flexibility expand function for USB, WiFi, 4G LTE, Isolated COM
  • VESA and wall mount design
Sale to corporate customers
Get individual price by e-mail
  • CI770A
  • Lexsystem
With an excellent fanless supporting up to Intel Mobile Ivy Bridge CPU, TINO brings you a... more
Product information "TINO - CI770A"

With an excellent fanless supporting up to Intel Mobile Ivy Bridge CPU,TINO brings you a whole new experience. Performance and quiet working enviornment can be delivered at thesame time without compromise.

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MODEL TINO 2PCI + CI770A-6C System Dimension(WxDxH) 268W x 182D x 110H... more
MODEL TINO 2PCI + CI770A-6C
System Dimension(WxDxH) 268W x 182D x 110H mm
Weight(Incl.M/B) 6 kg
CPU Intel Mobile Ivy Bridge Processor
Chipset Intel Panther Point (PCH) QM77
Memory Type / Capacity DDR3 1333 / 1600 MHz, Max up to 16GB
SO-DIMM 2
SSD storage CF (CFast) N/A
mSATA Yes
On Board SSD Optional
HDD Space 2.5" HDD x 1
VGA / DP Yes
HDMI / DVI DVI / HDMI
USB Built-in 4 x USB, expand up to 9 x USB
(USB 3.0 x 4 + USB 2.0 x 5)
PS2 KB/MS Optional
COM Built-in 4 x COM, expand up to 6 x COM
PCI / PCIe 2 (Optional)
Mini-PCIe 2
SIM Card Holder 2
GPIO 8DI / 8DO (Optional)
Ethernet 2 x Intel GbE
Mic-in / Line-out Yes
Power Input DC IN +12V
Expansion PoE LANs, GPS, IEEE1394,
3G / 4G, Bluetooth, WI-FI, I/O
Optional MB
Operating Temp. 0~45°C for HDD,
-20°C~60°C for mSATA / 2.5" SSD HDD
Operating Humidity 5%~95% @ 60°C, non-condensing
  • Download PDF Datasheet LEXCOM TINO - CI770A


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