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19" 1U fanless system + CI770A

Productfeatures LEXCOM 19" 1U fanless system + CI770A

  • Intel Pather Point (PCH) QM77
  • DDR3 1333 MT/s, up to max 16GB
  • Display: VGA, DVI & HDMI
  • 2 x Intel GbE, 9 x USB 2.0, 6 x COM, Line-out / Mic-in
  • 2 x Mini PCIe, 2 x PCI / PCIe
  • 2 x 3G SIM-Card slots
  • 2.5" HDD x 2 or 3.5" HDD x 2
Sale to corporate customers
Get individual price by e-mail
  • DF1-6AA033
  • LEXCOM
  MODEL 19" 1U lüftzerloses System  +  CI770A... more
Product information "19" 1U fanless system + CI770A"

 

MODEL 19" 1U lüftzerloses System + CI770A
Dimensions(WxDxH) 440W x 360D x 44.3H mm
Weight(incl.M/B) 5 kg
CPU Intel Mobile Ivy Bridge Prozessor
Chipset Intel Panther Point (PCH) QM77
RAM Type / Capacity DDR3 1333 / 1600 MT/s, bis zu Max 16GB
SO-DIMM 2
On board storage N/A
SSD storage mSATA Yes
On Board SSD N/A
HDD frame 2.5" HDD x 2 or 3.5" HDD x 2
VGA Yes
DVI / HDMI HDMI / DVI
USB Built-in 4 x USB, expandable up to 9 x USB
(USB 3.0 x 4+ USB 2.0 x 5)
PS2 KB/MS optional
COM Built-in 4 x COM, expandable up to 6 x COM, oder
Built-in 4 x COM, expandable up to 10 x COM
PCI / PCIe 2
Mini-PCIe 2
SIM-Card slot 2
GPIO 8DI / 8DO (optional)
Ethernet Intel GbE x 2
Mic-in / Line-out Yes
Input DC IN +12V
Extensions PoE LANs, GPS, IEEE1394, 3G, Bluetooth, WI-FI, I/O
Optional MB CI847AW / 3I770AW / CI170A
Operating temperature 0~45°C for HDD, -20°C~60°C for mSATA / 2.5" SSD HDD
Operating humidity 5~95% @ 60°C, not condensing

 

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MODEL 19" 1U Fanless system + CI770A System Dimension(WxDxH) 440W x 360D... more
MODEL 19" 1U Fanless system + CI770A
System Dimension(WxDxH) 440W x 360D x 44.3H mm
Weight(Incl.M/B) 5 kg
CPU Intel Mobile Ivy Bridge Processor
Chipset Intel Panther Point (PCH) QM77
Memory Type / Capacity DDR3 1333 / 1600 MHz, Max up to 16GB
SO-DIMM 2
On board memory N/A
SSD storage mSATA Yes
On Board SSD N/A
HDD Space 2.5" HDD x 2 or 3.5" HDD x 2
VGA Yes
DVI / HDMI HDMI / DVI
USB Built-in 4 x USB, expand up to 9 x USB
(USB 3.0 x 4+ USB 2.0 x 5)
PS2 KB/MS Optional
COM Built-in 4 x COM, expand up to 6 x COM, or
Built-in 4 x COM, expand up to 10 x COM
PCI / PCIe 2
Mini-PCIe 2
SIM Card Holder 2
GPIO 8DI / 8DO (Optional)
Ethernet Intel GbE x 2
Mic-in / Line-out Yes
Power Input DC IN +12V
Expansion PoE LANs, GPS, IEEE1394, 3G,
Bluetooth, WI-FI, I/O
Optional MB CI847AW / 3I770AW / CI170A
Operating Temp 0~45°C for HDD, -20°C~60°C for mSATA / 2.5" SSD HDD
Operating Humidity 5~95% @ 60°C, non-condensing
  • Download PDF Datasheet LEXCOM 19" 1U lüfterloses System + CI770A


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