Productfeatures Neousys SEMIL-1341GC
- Fanless GPU computer with NVIDIA® Quadro P2200
- Guaranteed non-throttling GPU performance up to 62°C ambient
- Intel® Xeon® E or 9th/ 8th-Gen Core™ i7/ i5/ i3 CPU
- Patented 2U 19" chassis for rack or wall-mount*
- Four 802.3at Gigabit PoE+ ports via M12 X-coded connectors
- VGA, USB 2.0 and COM ports via M12 A-coded connectors
- 1x DisplayPort and 3x USB 3.1 Gen1 ports
- 8V to 48V wide-range DC input
- Built-in ignition power control
- CE, FCC and EN 50155 certified
- Order number: SEMIL-1321GC
- Manufacturer: Neousys
SEMIL-1321GC is the world's first wide-temperature fanless edge AI computer supporting NVIDIA® Quadro P2200 for demanding environments. Coupled with Intel® Xeon® E or 9th/ 8th-Gen Core™ CPU, the system delivers excellent CPU and GPU performances for modern edge AI applications. SEMIL-1321GC features Neousys' patented thermal system architecture* to guarantee -25°C to 70°C fanless operation in a rack- or wall-mountable 2U 19" enclosure.
SEMIL-1300GC series features an advanced passive cooling design to ensure operation in high-temperature environments without the GPU throttling. Compatible with a Quadro P2200 GPU, users can utilize the scalable GPU performance up to 8.1 TFLOPS in FP32 or 130 TOPS in INT8. It leverages M12 connectors for Gigabit PoE+, USB 2.0, VGA and COM ports to offer rugged cable connectivity. Other high-speed computer I/Os include DisplayPort, USB 3.1 Gen1, optional 10G Ethernet and storage interfaces such as M2. for NVMe SSD and SATA ports, making SEMIL-1321GC expandable and versatile.
The flourishing GPU-powered deep learning systems actualized real-time AI inference applications at the edge, where rough conditions are expected. Combining Quadro P2200, wide-temperature fanless design and rugged M12 connectors, the SEMIL-1321GC reveals unprecedented possibilities of deploying AI to places that have yet to be reached.
System Core | ||
---|---|---|
Processor | Supporting Intel® Xeon® E and 9th/ 8th-Gen CPU (LGA1151 socket) - Xeon E 2278GE (8C/16T) / 2278GEL (8C/16T) / 2176G (6C/12T) - i7-9700E, i7-9700TE, i7-8700, i7-8700T - i5-9500E, i5-9500TE, i5-8500, i5-8500T - i3-9100E, i3-9100TE, i3-8100, i3-8100T | |
Chipset | Intel® C246 platform controller hub | |
Graphics | Integrated Intel® UHD Graphics 630 | |
Acceleration GPU | NVIDIA® Quadro P2200 for AI inference | |
Memory | Up to 64 GB ECC/ non-ECC DDR4-2666/ 2400 SDRAM(two SODIMM sockets) | |
AMT | Supports AMT 12.0 | |
TPM | Supports TPM 2.0 | |
I/O Interface | ||
PoE+ | 1x IEEE 802.3at (25.5W) Gigabit PoE+ ports by Intel® I219 (M12 X-coded) 3x IEEE 802.3at (25.5W) Gigabit PoE+ ports by Intel® I210 (M12 X-coded) | |
10 GbE Port(Build Option) | Optional: 1x 10 GbE port by Intel® X550AT controller (M12 X-coded)** | |
Native Video Port | 1x VGA (M12 A-coded), supporting 1920 x 1200 resolution 1x DisplayPort connector, supporting 4096 x 2304 resolution | |
Series Port | 2x 3-wires RS-232 ports COM1 & COM2 (M12 A-coded) 1x software-programmable RS-232/ 422/ 485 port (COM3, DB9) 1x RS-232 port (COM4, DB9) | |
USB | 3x USB 3.1 Gen1 2x USB 2.0 (M12 A-coded) 1x USB 2.0 (internal) | |
Audio | 1x 3.5 mm jack for mic-in and speaker-out | |
Storage Interface | ||
SATA HDD | 2x Internal SATA port for 2.5" HDD/ SSD installation, supporting RAID 0/ 1 | |
mSATA | 2x full-size mSATA port (mux with mini-PCIe) | |
M.2 | 1x M.2 2280 M key socket (PCIe Gen3 x4) for NVMe SSD or Intel® Optane™ memory installation | |
Expansion Bus | ||
Mini PCI-E | 2x full-size mini PCI Express sockets (mux with mSATA) 1x M.2 3042/ 3052 B key socket for selected M.2 4G/ 5G module 1x M.2 2242/ 2252 E key for selected WiFi module | |
Power Supply | ||
DC Input | 8V to 48V DC input | |
Ignition Control | Built-in ignition power control | |
Mechanical | ||
Dimension | 440mm (W) x 310mm (D) x 86.5mm (H) (excl. rack-mount bracket) | |
Weight | 12Kg | |
Mounting | Rack-mounting and wall-mounting | |
Environmental | ||
Operating Temperature | with 35W CPU -40°C ~ 70°C **** with >= 65W CPU -40°C ~ 70°C ***/ **** (configured as 35W TDP mode) -40°C ~ 50°C ***/ **** (configured as 65W TDP mode) | |
Storage Temperature | -40°C ~85°C | |
Humidity | 10%~90% , non-condensing | |
Vibration | MIL-STD-810G, Method 514.7, Category 4 | |
Shock | MIL-STD-810G, Method 516.7, Procedure I | |
EMC | EN-50155, CE/FCC Class A, according to EN 55032 & EN 55035 |